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This technology reduces the cost of testing electronic chips while enabling tests on high density chips and systems-on-a-chip, which are increasing in importance as portable devices increase in the market. The non-contact coupling of the probes eliminates many of the problems associated with state of the art tests. Testing is a major cost in the microelectronics...

Published: 12/19/2019 | Updated: 11/12/2013 | Inventor(s): Pierre Berini, Chengkun Chen

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Category(s): Digital Economy, Engineering, Manufacturing & Materials